UFP 1001 POWDER RESIN
USE FOR PARTICLE BOARD/ CHIPBOARD /MDF

Advantages 

 UFP 1001 powder resin developed from liquid Urea Formaldehyde Resin /UFR. UFP1001 is easy to transport and has  storage life up to 9 months unlike UFR liquid only last for less than 1 month. It is very suitable when production are not predictable.  

Technical information

Particle board / Chipboard structure

Typical Properties of UFP 1001

Preparation of Glue Mix *

• The lower the glue mix cost and free formaldehyde emission, up to 10 parts of urea can be added to the above mentioned glue mix.

1. Pour about 2/3 of the required water in the mixer and start mixing.
2. Add all the resin and mix until lumps smooth out
3. Slowly add the hardener and the balance of the required water and mix for another 3 to 5 minutes. The mixture is ready for spraying.

Wax Emulsion
A suitable wax emulsion may be used to improve the water resistance and dimensional stability of the chipboard. This emulsion should be able to tolerate the mildly acidic nature of the resin and it is
usually employed at a level of about 0.5 to 1 % wax solid to dry chip weight and may be sprayed separately or mixed with the resin.

Glue Application
The resin mix is sprayed on to the chips either by batch or continuous running and the normal resin level varies from 6 – 10 % resin solids or dry chips. In sandwich boards, the resin content in the face chips will be towards the higher figure and that of the core chips at the lower end of these limits.

The coated chips should not be held too long before forming and pressing, especially at high ambient temperature. To prevent boards from pre curing, warm caulks should be avoided.

Pressing is effected at temperature ranging from 140 – 200oC. the former in multiple daylight presses, the letter in single daylight presses where shorter pressing times are required. The speed with which the press is brought to its stops largely controls the properties of the produced board. After reaching the stops, the pressure on the press has to be reduced to allow some of the steam to escape after pressing, the board must be cooled to bellow 100oC, or stacked in packs (of not more than 50 cm thickness) to avoid discoloration and deterioration of the bond by over – curing. To achieve better moisture distribution, the boards should be kept in stack for 2 or 3 days before further handling.

Pressing Times
The minimum curing time can only be determined by practical trials. It depends upon the pH of the
chips, the hardener used, the platen temperature and thickness and density of the finished board. As a rough guide, the time may range from 10 minutes at 140oC to less than 5 minutes at above 180oC for an 18 mm board of average density.

TECHNICAL DATA FOR PARTICLES BOARD PRODUCTION

1) Recommended Glue Formulation

2) Preparation of Glue Mix

1. Pour 1/3 of the required water for the total glue mix into the mixer.
2. Start the mixer, add the resin powder in small portions and mix until all lumps are dissolved.
3. Add the water repellent emulsion.
4. Add the rest of the water and hardener, and mix until the glue mix is homogeneous

3) Moisture content of Particles
The raw material is normally dried to a moisture content of 3-5 %. Particles with a higher moisture content require longer pressing time. A moisture content of more than 8% should be avoided unless expressly required.

4) Coating of particles
Amounts of resin required (calculated on dry weight of particles ).

* The minimum pressing time should be determined by trials in each individual case.
8) Formaldehyde fumes ( based on JAS.) below 5 ppm

Storage :
Store UFP 1001 in a cool dry place away from direct sunlight. Heat and moisture will cause the powder to harden whence it becomes useless.
In cases where there is leftover powder, secure bag to avoid exposure of powder to the environment. UFP 1001 should remain usable up to one year or longer. Hardener IWPH 101 can be kept indefinitely if not exposed to humidity.

In the original containers at 30^oC UFP 1001 Resin has a storage life of approximate 9 months. The maximum storage life is attained when UFP 1001 Resin is stored under dry and cool conditions. The product should always be protected from high temperature and high atmospheric humidity.
Direct sunlight renders UFP 1001 Resin rapidly unusable. It should, therefore, not to be stored in the open. Once a container has been opened, the contents should be used up as soon as possible.

PACKAGING AND SHIPPING INFORMATION.